Mold for plastic encapsulation
<span> Mold‑encapsulation molds are widely used in integrated circuits, power devices, flash memory, optoelectronics, and other fields. </span> <span> We boast a robust R&D team, with key members each bringing over 15 years of design and development expertise in the industry, enabling us to collaborate with clients on the development of a wide range of products. </span> <span> All process equipment is sourced from international manufacturers in Switzerland, Japan, the United States, and other countries, with precision maintained within 0.002 mm. </span> <span> The primary materials used for the molds are all specialized mold steels sourced from Sweden, the United States, Japan, and other countries. </span>
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Address: Lebao Industrial Park, Fengxin Road, Guangming District, Shenzhen
Phone: 86-755-27619011 27618959
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