Moulding Innovative Wonders

Provide customers with one-stop procurement solutionsfor semiconductor packaging equipment.

A thousand miles wide, reaching all corners of the world.

about yaotong

A thousand miles wide, reaching all corners of the world.

Shenzhen Yao Tong Technology Co., Ltd. was established in 2004, formerly known as Shenzhen Yidong Semiconductor Equipment Co., Ltd. It is a high-tech enterprise specializing in the R&D, manufacturing, and sales of semiconductor packaging molds and equipment. The company’s main products currently include fully computer-controlled intelligent servo plastic encapsulation presses, plastic encapsulation molds, automatic die‑stripping systems, and automatic punching‑and‑forming systems, which are widely used in the processing and manufacturing of discrete semiconductor devices, integrated circuits, optoelectronics, automotive electronics, and other products.

ISO 9001:2015 Quality Management System Certification

ISO 14001:2015 Environmental Management System Certification

ISO 45001:2018 Occupational Health and Safety Management System Certification

Multiple national patents

Smart Manufacturing Capability Maturity Level 3 Certification

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Service Hotline: 86-13828863027

Email：inactive_2@szyaotong.com

R & D, production, sales and service

State-level high-tech enterprise

22 +

Industry experience

6 +

Product Series

3000 +

Global Partner Clients

10000 +

Successful Delivery Plan

Product Center

Automatic rebar cutting, forming, and palletizing system

Feeding section: Material is supplied via a hopper; the workpiece is pushed by a pusher mechanism to the vision‑inspection station for identification, then gripped by a claw and conveyed to the robotic arm’s picking position. The robotic arm subsequently places the workpiece onto the infeed pusher track, from where it is advanced by a pushing mechanism onto the infeed conveyor. Pusher and guide rail assembly: A ratchet mechanism drives the product, feeding it into the die for rib cutting, forming, and part separation. Finally, the ratchet ejects the finished part from the right side of the die, while scrap frames fall through the bottom of the die into the scrap collection bin. An overload alarm is activated in the event of an overload. Powertrain: servo motor + gearbox + cam mechanism. Forming section: The forming gripper picks up the component and places it on the forming platform. Once the platform detects the presence of the component, the gripper presses it down and, via the forming mechanism, drives the forming block to correct any angular deviations in the component leads. The forming mechanism employs two independent sets of actuators to adjust lead angle deviations in both orthogonal directions. Flipping Section: Upon receiving the command, the flipping mechanism automatically picks up the product and rotates it to the designated orientation, then waits for palletizing. Tray-loading section: This section is equipped with two complete tray‑moving and collecting mechanisms, enhancing machine efficiency and reducing manual labor. Empty trays are stacked and fed in from the rear, then conveyed by a module to the loading station; once filled, they are transferred by the same module to the front for stacking and storage.

LQFP automatic molding

TO-251/252-4R/6R Automatic Lead-Forming System

Feeding section: Utilizes a dual‑magazine vertical‑ejection feeding system, enabling continuous operation during magazine changes. Material-handling section: The product is picked up by a gripper from the magazine and placed onto the conveyor track. Feed section: A stepper motor‑driven feeding mechanism accurately positions the product, and the system triggers a card‑presence alarm when a card is detected. Push‑and‑guide mechanism: A toothed conveyor rod advances the product; it engages the blister pack from beneath and feeds it into the mold for rib cutting, forming, and separation. Finally, a pusher tooth ejects the product to the right onto an inclined platform, where the tube‑insertion operation is performed. Power section: A servo motor and a reducer drive the cam mechanism for punching and cutting. Material receiving section: Two receiving methods are available—bulk and tube‑based. In the tube‑based mode, empty tubes are stacked at the rear and placed in the empty‑tube tray; a tube‑feeding mechanism then conveys these empty tubes to the loading station to perform the tube‑loading operation, after which the loaded tubes are pushed into the front‑mounted tube box.

Accessories

Extensive experience in equipment development and application enables us to deliver tailored solutions. The machining equipment ensures the dimensional accuracy of the components. Rational selection of imported materials enhances service life and stability. Advanced process management ensures timeliness.

solution

Solution

It is widely used in the manufacturing of discrete semiconductor devices, integrated circuits, optoelectronic components, automotive electronics, and other products.

Discrete semiconductor devices

Discrete semiconductor devices are individually packaged semiconductor components that perform a single electrical function. Complementing integrated circuits, they serve as the fundamental building blocks of electronic systems.

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Discrete semiconductor devices

Integrated circuit

An integrated circuit is a miniature electronic device that integrates numerous electronic components, such as transistors, resistors, and capacitors, onto a single silicon-based chip using semiconductor fabrication processes, thereby realizing a complete circuit function.

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Integrated circuit

Optoelectronics

Optoelectronic technology is a field of study based on optoelectronics, focusing on the mutual conversion, transmission, and applications of light and electricity.

Consultation

Optoelectronics

Automotive electronics

Automotive electronics is a collective term for electronic technologies and products applied in the automotive sector, integrating semiconductors, sensors, control algorithms, and communication technologies. It serves as the cornerstone of vehicle intelligence and connectivity.

Consultation

Automotive electronics

Other industries

Semiconductors and electronic components are widely used across numerous industries, including industrial manufacturing, smart homes, medical devices, telecommunications base stations, aerospace, and security surveillance.

Consultation

Other industries

Core strengths

Core Advantages

It is widely used in the manufacturing of discrete semiconductor devices, integrated circuits, optoelectronic components, automotive electronics, and other products.

Service Advantages

The company has an after-sales service department and operates a 24-hour hotline to promptly address customer inquiries and provide technical support. For on-site service, our technicians will arrive at the customer’s location within 36 hours.

Testing Advantages

We conduct meticulous and rigorous inspections throughout the entire manufacturing process of each component to ensure precision and reliability, striving for survival through quality and providing customers with packaging equipment that delivers superior performance, exceptional quality, and long-lasting durability.

Equipment Advantages

To ensure product quality and reliability, we have introduced advanced machining equipment, including wire EDM (both water‑based and oil‑based), optical contour grinders, electrical discharge machines, high‑speed vertical machining centers, and CNC surface grinders...

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News center

News Center

Share company updates and industry technical information at any time.

2026-08-21

2026

08-21

May 2026, SEMICON SEA 2026 (Malaysia)

SEMICON SEA 2026 (Malaysia), the semiconductor exhibition, will open on May 5, 2026, at the MALAYSIA INTERNATIONAL TRADE AND EXHIBITION CENTRE. The event runs from May 5 to May 7, 2026. Youtong Technology’s booth number is 1651, Level 1, Hall 2. We cordially invite you to attend, visit, and offer your guidance!

2026-08-21

2026

08-21

May 2025, SEMICON SEA 2025 (Singapore)

SEMICON SEA 2025 (Singapore), the semiconductor exhibition, will open on May 20, 2025, at the Sands Expo and Convention Centre. The event runs from May 20 to May 22, 2025. Youtong Technology’s booth number is B2137/E1/Basement 2/CHINA PAVILLION/EXPO HALL. We cordially invite you to attend, visit, and offer your guidance!

2025-03-20

2025

03-20

March 2025: SEMICON® China 2025 Semiconductor Exhibition

SEMICON® China 2025, the semiconductor exhibition, will open on March 26, 2025, at the Shanghai New International Expo Center. Exhibition dates: March 26–28, 2025 Yotta Technology booth number: Hall N3, Booth 3806 We cordially invite you to attend, visit, and offer your guidance!

2024-03-20

2024

03-20

March 2024: SEMICON® China 2024 Semiconductor Exhibition

SEMICON® China 2024, the semiconductor exhibition, will open on March 20, 2024, at the Shanghai New International Expo Center. Exhibition dates: March 20–22, 2024 Yaotong Technology booth number: Hall N4, Booth 4816 We cordially invite you to attend, visit, and offer your guidance!

2023-06-29

2023

06-29

June 2023: SEMICON® China 2023 Semiconductor Exhibition

SEMICON® China 2023, the semiconductor exhibition, will open on June 29, 2023, at the Shanghai New International Expo Center. Exhibition dates: June 29–July 1, 2023 Youtong Technology booth number: Hall E3, Booth E3826 We cordially invite you to attend, visit, and offer your guidance!

2021-03-17

2021

03-17

March 2021: SEMICON® China 2021 Semiconductor Exhibition

SEMICON® China 2021 will open on March 17, 2021, at the Shanghai New International Expo Center. Exhibition dates: March 17–19, 2021 Yaotong Technology booth number: Hall N3, Booth 3800 We cordially invite you to attend, visit, and offer your guidance!

partner

Partner

By upholding continuous innovation, innovative management, and integrity in service, the company maintains sustained, stable, and rapid growth, becoming a loyal and long-term partner to both new and existing customers.

Changzhou Galaxy Century Microelectronics Co., Ltd.

Zhuhai Gree Electric Appliances Co., Ltd.

Yangzhou Yangjie Electronics Technology Co., Ltd.

Shenzhen SAI-FAR Microelectronics Co., Ltd.

Changdian Technology (Chuzhou) Co., Ltd.

Fujian Fushun Semiconductor Manufacturing Co., Ltd.

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Providing customers with a one-stop semiconductor packaging equipment procurement solution.

R & D, production, sales and service

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State-level high-tech enterprise

A thousand miles wide, reaching all corners of the world.

Contact Information

Address: Lebao Industrial Park, Fengxin Road, Guangming District, Shenzhen

Phone: 86-755-27619011 27618959

86-13828863027

WeChat Official Account

TikTok account

Business license