Scope of Business

Design and manufacturing of semiconductor packaging plastic encapsulation molds, automated packaging systems, consumables, and component parts.

Design and manufacturing of fully automated lead‑frame cutting and forming systems for semiconductor packaging, along with related consumables and components.

Design and Manufacturing of a Fully Automatic Lead Frame Patterning Machine for Semiconductor Packaging

Design and Manufacturing of a Servo‑Driven Plastic Molding Press for Semiconductor Packaging

Design and manufacturing of various precision mechanical components

R & D, production, sales and service

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State-level high-tech enterprise

A thousand miles wide, reaching all corners of the world.

Contact Information

Address: Lebao Industrial Park, Fengxin Road, Guangming District, Shenzhen

Phone: 86-755-27619011 27618959

86-13828863027

WeChat Official Account

TikTok account

Business license