Shenzhen YaoTong Technology Co., Ltd

R & D, production, sales and service

State-level high-tech enterprise

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Service Hotline:

13828863027

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Chinese

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MOLDING TOOLING

Classification:

Molding Tooling

Molding tooling are extensively utilized across various domains, including integrated circuits, power devices, FLASH, and optoelectronics. We boast a robust R&D team, whose principal members have amassed over 15 years of design and development experience in the industry, capable of developing diverse products tailored to client requirements. Utilizing international leading-edge precision processing equipment from nations such as Switzerland, Japan, and the United States, we guarantee a processing precision within 0.002mm. The molds are fabricated using superior-grade materials obtained from Sweden, the United States, and Japan.

Technical Specifications

 

Item

Description

Mold Specification

Compatible with various types of supports, substrates, and wafer-level packaging.

Additional Features Material Use

Vacuum support

Bi-directional core extraction structure

Maximum Cavity Size

ASP23, Nikkokasei

Mold Specification

100mm*300mm

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