Mold for plastic encapsulation

Mold‑encapsulation molds are widely used in integrated circuits, power devices, flash memory, optoelectronics, and other fields. We boast a robust R&D team, with key members each bringing over 15 years of design and development expertise in the industry, enabling us to collaborate with clients on the development of a wide range of products. All process equipment is sourced from international manufacturers in Switzerland, Japan, the United States, and other countries, with precision maintained within 0.002 mm. The primary materials used for the molds are all specialized mold steels sourced from Sweden, the United States, Japan, and other countries.

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Address: Lebao Industrial Park, Fengxin Road, Guangming District, Shenzhen

Phone: 86-755-27619011 27618959

86-13828863027

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Parameter Name	Specification and Model
Mold Type	Compatible with various types of holders, substrates, and wafer-level packaging.
Additional Features	Vacuum-assisted
Additional Features	Double-sided core-pulling structure
Material Application	ASP23\Daylight Chemicalization
Maximum cavity applicable size	100mm*300mm