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Laser Marking & Automatic Tab-Forming System
Feeding section: Material is supplied from a hopper; a pusher rod ejects the parts from the hopper, and a roller-driven belt conveys them to the marking station. The conveyor track is equipped with material‑drop detection and anti‑reverse sensing functions.
Marking section: Equipped with a dual-laser-head marking machine, full‑panel marking takes only 4–6 seconds, and a CCD system is included to verify marking quality.
Flipping section: The material is conveyed to the designated position via a roller-driven belt, and a rotary cylinder is used to flip the workpiece.
Pusher and guide rail assembly: The entire rebar‑cutting system uses rollers and a belt to convey the material sheets, with the sheets at the front and rear of the die driven by indexing pins. Scrap frames are ejected from the right side via an indexing pin, and the system triggers a card‑out alarm (timeout alarm) when a card is present.
Power section: A servo motor and a reducer drive the cam mechanism for punching and cutting.
Automatic rebar cutting, forming, and palletizing system
Feeding section: Material is supplied via a hopper; the workpiece is pushed by a pusher mechanism to the vision‑inspection station for identification, then gripped by a claw and conveyed to the robotic arm’s picking position. The robotic arm subsequently places the workpiece onto the infeed pusher track, from where it is advanced by a pushing mechanism onto the infeed conveyor.
Pusher and guide rail assembly: A ratchet mechanism drives the product, feeding it into the die for rib cutting, forming, and part separation. Finally, the ratchet ejects the finished part from the right side of the die, while scrap frames fall through the bottom of the die into the scrap collection bin. An overload alarm is activated in the event of an overload.
Powertrain: servo motor + gearbox + cam mechanism.
Forming section: The forming gripper picks up the component and places it on the forming platform. Once the platform detects the presence of the component, the gripper presses it down and, via the forming mechanism, drives the forming block to correct any angular deviations in the component leads. The forming mechanism employs two independent sets of actuators to adjust lead angle deviations in both orthogonal directions.
Flipping Section: Upon receiving the command, the flipping mechanism automatically picks up the product and rotates it to the designated orientation, then waits for palletizing.
Tray-loading section: This section is equipped with two complete tray‑moving and collecting mechanisms, enhancing machine efficiency and reducing manual labor. Empty trays are stacked and fed in from the rear, then conveyed by a module to the loading station; once filled, they are transferred by the same module to the front for stacking and storage.
The entire system is equipped with world‑class servo motors, drives, and oil pumps manufactured by Japan’s Daikin. It employs closed-loop control, which differs fundamentally from conventional variable‑frequency drives in terms of control accuracy and the service life of key components. This results in more precise control, eliminates the need for cooling water, and consumes only 0.4 kWh per hour.
The oil tube is made of high-strength seamless steel tubing, offering excellent sealing performance, long service life, and no rubber residue.
The control system employs a PLC combined with a large‑size touch screen, allowing all parameters—position, pressure, flow rate, and speed—to be adjusted via the human–machine interface.
It employs a fully CNC‑controlled temperature regulation system imported from South Korea, featuring 32 temperature control points organized into eight modules and connected to a PLC. All setpoint temperatures are displayed on the touch screen, allowing real-time adjustment of the PDI value and gain, with a control accuracy of ±1°C.
The oil pump features a dual-pump design and can be optionally equipped with a servo valve to deliver highly precise injection system control.
Molding pressure: 330/550 tons.
Mold for plastic encapsulation
Mold‑encapsulation molds are widely used in integrated circuits, power devices, flash memory, optoelectronics, and other fields.
We boast a robust R&D team, with key members each bringing over 15 years of design and development expertise in the industry, enabling us to collaborate with clients on the development of a wide range of products.
All process equipment is sourced from international manufacturers in Switzerland, Japan, the United States, and other countries, with precision maintained within 0.002 mm.
The primary materials used for the molds are all specialized mold steels sourced from Sweden, the United States, Japan, and other countries.