R & D, production, sales and service
State-level high-tech enterprise
Service Hotline:
The trade friction between China and the United States has strengthened China's determination to develop the semiconductor industry independently
• Since 2018, anti-globalization has been upgraded. The US has taken the initiative to launch trade frictions with China, represented by the ZTE incident, which has exposed China's shortcomings in key technology fields.
• U.S. restrictions on the export of core components to domestic technology leaders directly affected domestic technology companies, and ZTE's production was suspended for a time. In May this year, the US once again put Huawei on its "physical list", which caused a big stir. In an interview with Forbes magazine on June 17, Founder Ren Zhengfei said that huawei was expected to reduce production in the next two years and its sales revenue would drop by 30 billion US dollars. The restrictions in the United States also have a great impact on Huawei, which has strong independent research and development capabilities.
• In the future, trade frictions between China and the US will show a trend of repeated back-and-forth for a long time. In China, the direction of developing core technologies has been fully defined from top to bottom, from government departments to enterprises, among which semiconductor is the top priority.
Related Information
The global integrated circuit equipment market is highly monopolized
• Characteristics: strong technical barriers brought by short technology renewal cycle, great market barriers brought by high degree of market monopoly, and extremely high recognition barriers brought by competition and cooperation among customers. Therefore, the integrated circuit equipment market is highly monopolized, and the segmentation market is dominant；
• IC industry belongs to the industry with heavy capital expenditure, "big investment, big income, medium investment, no income, small investment, big loss";
• According to the global Wafer Fab Forecast report released by SEMI, 62 new wafer processing lines are expected to be built globally in the four years from 2017 to 2020. Among them, 26 new fabs will be built in mainland China, making it the most active region in the world in terms of new wafer fab construction. The total investment is expected to account for 42% of new wafer fab construction globally, which is the highest in the world.
Building 1 and 4, Lebao Industrial Park, Fengxin Road, Guangming New District, Shenzhen,China.
公众号
抖音号
SEOTechnical Support:China Enterprise Power Shenzhen